LSI 3D-CG

65nm-int-8

Interconnect structure of 65nm technology
(10 metal layers)
光源を変えてみるテスト

65nm-int-6

Interconnect structure of 65nm technology
(10 metal layers)

INV010-6

65nm inverter
self-luminance のテスト

INV010-5

65nm inverter
self-luminance のテスト

INV010-4

65nm inverter
self-luminance のテスト

INV010-3

65nm inverter
self-luminance のテスト

65nm-int-5

Interconnect structure of 65nm technology

65nm-int-4_anime

Interconnect structure of 65nm technology
(10 metal layers)
切断面を動かすアニメーションの実験
[Download .skp file]

65nm-int-3

Interconnect structure of 65nm technology
(10 metal layers)
レンダリング後に Gimp で字を入れてみる

65nm-int-2

Interconnect structure of 65nm technology
(10 metal layers)
[Download .skp file]

65nm-int-1

Interconnect structure of 65nm technology
(10 metal layers)
[Download .skp file]

INV010-2

65nm Inverter
[Download .skp file]

inv-scaling-2.

Inverter scaling from 1.2um to 22nm
[Download .skp file]

inv-scaling

Inverter scaling from 1.2um to 22nm

65nm-1

Interconnect structure of 65nm technology
(10 metal layers)

65nm-2

Interconnect structure of 65nm technology
(10 metal layers)

nmos-1

Test structure for
transistor RF characteristics

nmos-2

Test structure for
transistor RF characteristics

Tr-TEG-1

Test structure for
transistor DC characteristics

Tr-TEG-2

Test structure for
transistor DC characteristics

Tr-TEG-3

Test structure for
transistor DC characteristics

Tr-TEG-4

Test structure for
transistor DC characteristics

DFF-1

D-flipflop (a 180nm CMOS process)

DFF-2

D-flipflop (a 180nm CMOS process)

spiral

Spiral inductor

RF-pad

RF pad



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LSI 3D-CG is licensed under a Creative Commons Public Domain License.